 2016 Microchip Technology Inc.

DS20005616A-page 13

PL610-01/-02/-03

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office

.

Examples:

a) PL610-01D6C:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Die, 6 mm

Thickness, Commercial Temp.

Range, Tray

b) PL610-02E8C:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Die

(non-conductive back), 8 mm

Thickness, Commercial Temp.

Range, Tray

c) PL610-03VAC:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Wafer

(non-conductive back), 10 mm

Thickness, Commercial Temp.

Range, Tray

d) PL610-01WC:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Wafer, 12 mm

Thickness, Commercial Temp.

Range, Tray

e) PL610-02W8C:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Wafer, 8 mm

Thickness, Commercial Temp.

Range, Tray

f) PL610-03DAC:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Die, 10 mm

Thickness, Commercial Temp.

Range, Tray

g) PL610-02E6C:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Die

(non-conductive back), 6 mm

Thickness, Commercial Temp.

Range, Tray

h) PL610-01VC:

1.8V to 3.3V Single IC XO with

Frequency Tuning, Wafer

(non-conductive back), 12 mm

Thickness, Commercial Temp.

Range, Tray

PART NO.

X

Package

Device

Device:

PL610-01:

1.8V to 3.3V Single IC XO with Frequency

Tuning (10 MHz to 130 MHz)

PL610-02:

1.8V to 3.3V Single IC XO with Frequency

Tuning (10 MHz to 130 MHz)

PL610-03:

1.8V to 3.3V Single IC XO with Frequency

Tuning (10 MHz to 130 MHz)

Package:

D

=

Die

E

=

Die (with non-conductive backcoating)

V

=

Wafer (with non-conductive backcoating)

W=

Wafer

Thickness:

6

=

6 mm (Die Only)

8=

8 mm

A=

10 mm

none =

12 mm

Temperature:

C

=

0°C to +70°C (Commercial)

Media Type:

none =

Tray

X

Thickness

X

Media Type

X

Temperature