18

10

19

Be

D

Z

b

Z

e3

b1

E

PM-DIP18.EPS

PACKAGE MECHANICAL DATA

18 PINS - PLASTIC DIP

Information furnished is believed to be accurate and reliable. However, SGS-THOM SON Microelectronics assumes no res ponsibility

for the consequences of us e of such information nor for any infringement of patents or other rights of third parties which may result

from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-TH OMSON Microelec tronics.

Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life

support devices or sy stems without express written approval of SGS-THOMSON Microelectronics.

© 1992 SGS-THOMSON Microelectronics - A ll Rights Reserved

SGS-THOM SON Microelectronics GROUP OF C OMPANIES

Australia - Brazil - China - France - Germa ny - Hong Kong - Italy - Japan - K orea - M alaysia - M alta - Morocco

The Netherlands - Singapore - Spain - Sw eden - Switzerland - Taiwan - U nited Kingdo m - U .S.A.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

a1

0.254

0.010

B

1.39

1.65

0.055

0.064

b

0.46

0.018

b1

0.25

0.010

D

23.24

0.914

E

8.5

0.335

e

2.54

0.100

e3

20.32

0.800

F

7.1

0.280

i

3.93

0.155

L

3.3

0.130

Z

1.27

1.59

0.050

0.062

TDA7227

5/5