| 전자부품 데이터시트 검색엔진 |
|
TP5510 데이터시트(PDF) 11 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
TP5510 데이터시트(HTML) 11 Page - National Semiconductor (TI) |
|
11 / 12 page ![]() Applications Information POWER SUPPLIES While the pins of the AFE are well protected against electri- cal misuse it is recommended but not mandatory that the standard CMOS practice be followed ensuring that ground is connected to the device before any other connections are made In applications where the printed circuit board may be plugged into a ‘‘hot’’ socket with power and clocks already present an extra long ground pin in the connector should be used All ground connections to each device should meet at a common point as close as possible to the GNDA pin This minimizes the interaction of ground return currents flowing through a common bus impedance 01 mF supply decou- pling capacitors should be connected from this common ground point to VCC and VBB as close to the device as possible For best performance if more than 1 AFE is on a card the ground point of each AFE on a card should be connected to a common card ground in star formation rather than via a ground bus This common ground point should be decoupled to VCC and VBB with 10 mF capacitors Physical Dimensions inches (millimeters) unless otherwise noted Molded Small Outline Package (WM) Order Number TP5510WM NS Package Number M16B http www nationalcom 11 |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |