전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

Preview PDF HTML

MIC2874YCS 데이터시트(PDF) 18 Page - Micrel Semiconductor

부품명 MIC2874YCS
상세설명  1.2A High-Brightness Flash LED Driver with Single-Wire Serial Interface
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  MICREL [Micrel Semiconductor]
홈페이지  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2874YCS 데이터시트(HTML) 18 Page - Micrel Semiconductor

Back Button MIC2874YCS Datasheet HTML 14Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 15Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 16Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 17Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 18Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 19Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 20Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 21Page - Micrel Semiconductor MIC2874YCS Datasheet HTML 22Page - Micrel Semiconductor  
Zoom Inzoom in Zoom Outzoom out
 18 / 22 page
background image
Micrel, Inc.
MIC2874
A
CA
JC
DISS
J
T
)
(
P
T
+
θ
+
θ
×
=
Eq. 2
As can be seen in the diagram, total thermal resistance
θ
JA = θJC + θCA. Hence this can also be written as in
Equation 3:
A
JA
DISS
J
T
)
(
P
T
+
θ
×
=
Eq. 3
Since effectively all of the power losses (minus the
inductor losses) in the converter are dissipated within the
MIC2874 package, PDISS can be calculated thus:
Linear Mode:
DCR
2
I
]
1
η
1
[P
P
OUT
OUT
DISS
×
−
−
×
=
Eq. 4
Boost Mode:
DCR
2
D
1
I
]
1
η
1
[P
P
OUT
OUT
DISS
×
−
−
−
×
=
Eq. 5
Duty Cycle in Boost Mode:
OUT
IN
OUT
V
V
V
D
−
=
Eq. 6
where:
η = Efficiency taken from efficiency curves and DCR =
inductor DCR.
θ
JC
and
θ
JA
are found in the operating
ratings section of the data sheet.
Where the real board area differs from 1 inch square,
θ
CA
(the PCB thermal resistance) values for various PCB
copper areas can be taken from Figure 7. Figure 7 is taken
from Designing with Low Dropout Voltage Regulators
available from the Micrel website (“LDO Application
Hints”).
Figure 7. Graph to Determine PC Board Area for a Given
PCB Thermal Resistance
Figure 7 shows the total area of a round or square pad,
centered on the device. The solid trace represents the
area of a square, single sided, in horizontal orientation,
solder masked, copper PC board trace heat sink,
measured in square millimeters. No airflow is assumed.
The dashed line shows PC boards trace heat sink covered
in black oil-based paint and with 1.3m/sec (250 feet per
minute) airflow. This approaches a “best case” pad heat
sink. Conservative design dictates using the solid trace
data, which indicates that a maximum pad size of 5000
mm
2 is needed. This is a pad 71mm by 71mm (2.8 inches
per side).
August 26, 2014
18
Revision 1.0



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com