MIC5202 datasheet(13/22 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

DS20005614A-page 13

MIC5202

5.0

THERMAL CONSIDERATIONS

5.1

Layout

The MIC5202 (8-pin SOIC package) has the thermal

characteristics shown in Table 5-1, when mounted on a

single-layer copper-clad printed circuit board.

Multi-layer boards with a dedicated ground plane, wide

traces, and large supply bus lines provide better

thermal conductivity.

The “worst case” value of 160°C/W assumes no ground

plane, minimum trace widths, and a FR4 material

board.

5.2

Nominal Power Dissipation and

Die Temperature

At +25°C ambient temperature, the MIC5202 operates

reliably at up to 625 mW when mounted in the “worst

case” manner described in the previous section. At an

ambient temperature of +55°C, the device can safely

dissipate 440 mW. These power levels are equivalent

to a die temperature of +125°C, which corresponds to

the

recommended

maximum

temperature

for

non-military grade silicon integrated circuits.

TABLE 5-1:

THERMAL CHARACTERISTIC

CONSIDERATIONS

PC Board Dielectric

θJA

FR4

160°C/W

Ceramic

120°C/W

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