10

Operating Precautions

1. Recommended Temperature Profile

(Lead-free soldering possible)

2. Recommended Hand Solder

Conditions

Soldering iron temperature : 350 ± 10ç, soldering time : within 3 seconds

3. Recommended Screen Thickness,

Open Ratio (Pattern Area Ratio)

Thickness 0.1mm, Open ratio : 100%

4. Warpage of PC board

Maximum of 0.02mm at the connector center, with both ends of the connector

as reference points.

5. Cleaning Condition

Cleaning with IPA is possible. (Cleaning is not recommended. In case of

cleaning, please evaluate if it causes a decrease in the performance which

includes mechanical operation and environmental resistance.)

6. Precautions

■ When inserting crimp-type (solderless) terminals to crimping (solderless)

sockets, to maintain reliable performance, please do not insert obliquely.

■ DO NOT mate/un-mate a non-terminated plug with a non-mounted

receptacles. This may lead to damage or deformation of the contacts.

■ Please note that pulling on the wires or cable during un-mating may cause

damage.

■ DO NOT apply flux to the contact terminals when hand soldering the

receptacle to the board. Flux can wick into the electrical contact areas and

may lead to connection failures.

■ Slight discoloration on the insulating materials will not affect form, fit or

function of the connectors.

■ Please refer to the following for the points for proper handling regarding

mating/unmating operations.

“DF59 Insertion and Removal Manual”

“DF59S Insertion and Removal Manual” ATAD-H0651

“DF59SN Insertion and Removal Manual” ATAD-H0719

“DF59M Operation manual” ATAD-H0779

[Applicable Conditions]

1. Peak Temperature : MAX 250ç

2. Heated Area : 220ç or above, within 60 sec.

3. Pre-heating Area : 150 to 180ç, 90 to 120 sec.

4. Number of Times : within 2 times

*Measured at contact lead area

Please be noted that the reflow condition may vary depending on soldering

paste type, manufacturer of soldering material, board size, as well as conditions

of other mounting materials.

(*1) Above temperature profile is our recommended value.

50

60sec MAX

100

150

200

250

0

PRE-HEATING TIME

SOLDERING TIME

TIME（sec）

90 − 120sec

180ç

220ç

10sec MAX

MAX 250ç