LIB1000 datasheet(9/15 Pages) LUXPIA

9 / 15 page

(Ver 1.0)

8/14

9. Reliability

9.1. test items and results

no.

test item

Test Conditions

Note

number of

damaged

sample

resistance to soldering heat

(reflow)

Tsld=260oC, 10sec

2 times

0/22

solderability

(reflow)

Tsld=215± 5oC, 3sec

1 time

over 95%

0/22

temperature cycle

-40oC through +25oC to +85℃

(30min/5min/30min)

100 cycles

0/22

high temperature storage

Ta=85℃

1000 hrs

0/22

high humidity and

temperature storage

Ta=60℃, RH=90%

1000 hrs

0/22

low temperature storage

Ta=-30℃

1000 hrs

0/22

steady-state operating

lifetime test

Ta=25℃, IF=10mA

500 hrs

0/22

steady-state operating

lifetime of high humidity

and temperature

Ta=60℃, RH=90%, IF=5mA

500 hrs

0/22

steady-state operating

lifetime of low temperature

Ta=-30℃, IF=10mA

500 hrs

0/22

* Reliability is measure on the thermal emission PCB for LED Reliability test.

9.2. criteria for judging the damage

item

symbol

test condition

criteria for judgement

min

max

forward voltage

IF = 5mA

U.S.L.5) × 1.2

luminous intensity

IF = 5mA

L.S.L.6) × 0.5

5) U.S.L. : upper standard level

6) L.S.L. : lower standard level

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