Axial Lead Schottky Diode

Rev. V1

1N5819

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Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate (TL to TP)

3°C/second maximum

3°C/second maximum

Preheat

- Temperature Minimum (TSMIN)

- Temperature Maximum (TSMAX)

- Time (Minimum to maximum) (ts)

100°C

150°C

60-120 seconds

150°C

200°C

60-180 seconds

TSMAX to TL

- Ramp-up Rate

—

3°C/second maximum

Time Maintained above:

- Temperature (TL)

- Time (tL)

183°C

60-150 seconds

217°C

60-150 seconds

Peak Temperature (TP)

225 +0 / -5°C

260 +0 / -5°C

Time within 5°C of actual Peak Tempera-

ture (TP)

10-30 seconds

20-40 seconds

Ramp-down Rate

6°C/second maximum

6°C/second maximum

Time 25°C to Peak Temperature

6 minutes maximum

8 minutes maximum

Time-Temperature Profile for Sn 60 / Pb 40 or RoHS Type Solders

Solder Re-Flow Time-Temperature Function