AD7616BSTZ datasheet(11/51 Pages) AD

11 / 51 page

AD7616

Data Sheet

Rev. 0 | Page 10 of 50

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

CC to AGND

−0.3 V to +7 V

DRIVE to AGND

−0.3 V to V

CC + 0.3 V

Analog Input Voltage to AGND1

±21 V

Digital Input Voltage to AGND

−0.3 V to V

DRIVE + 0.3 V

Digital Output Voltage to AGND

−0.3 V to V

DRIVE + 0.3 V

REFINOUT to AGND

−0.3 V to V

CC + 0.3 V

Input Current to Any Pin Except

Supplies1

±10 mA

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Soldering Reflow

Pb/Sn Temperature (10 sec to 30 sec)

240 (+0)°C

Pb-Free Temperature

260 (+0)°C

ESD

All Pins Except Analog Inputs

2 kV

Analog Input Pins Only

8 kV

1 Transient currents of up to 100 mA do not cause silicon controlled rectifier

(SCR) latch-up.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 6. Thermal Resistance

Package Type

Unit

ST-80-21

7.5

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51.

ESD CAUTION

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