STS30 datasheet(13/17 Pages) ETC2

13 / 17 page

www.sensirion.com

November 2016 - Version 1

13/17

5.2

Package Outline

Figure 7

Dimensional drawing of STS3x-DIS sensor package

Parameter

Symbol

Min

Nom. Max Units Comments

Package height

0.8

0.9

Leadframe height

0.2

Pad width

0.2

0.25

0.3

Package width

2.4

2.5

2.6

Center pad length

1.1

1.2

Package length

2.4

2.5

2.6

Center pad width

1.7

1.8

1.9

Pad pitch

0.5

Pad length

0.3

0.35

0.4

Center pad marking

T1xT2

0.3x45°

indicates the position of pin 1

Table 19 Package outline.

5.3

Land Pattern

Figure 8 shows the land pattern. The land pattern is

understood to be the open metal areas on the PCB, onto

which the DFN pads are soldered.

The solder mask is understood to be the insulating layer

on top of the PCB covering the copper traces. It is

recommended to design the solder pads as a Non-

Solder Mask Defined (NSMD) type. For NSMD pads, the

solder mask opening should provide a 60 μm to 75 μm

design clearance between any copper pad and solder

mask. As the pad pitch is only 0.5 mm we recommend to

have one solder mask opening for all 4 I/O pads on one

side.

For solder paste printing it is recommended to use a

laser-cut, stainless steel stencil with electro-polished

trapezoidal walls and with 0.1 or 0.125 mm stencil

thickness. The length of the stencil apertures for the I/O

pads should be the same as the PCB pads. However,

the position of the stencil apertures should have an offset

of 0.1 mm away from the center of the package. The die

pad aperture should cover about 70 % – 90 % of the die

pad area –thus it should have a size of about 0.9 mm x

1.6 mm.

For information on the soldering process and further

recommendation on the assembly process please

consult

the

Application

Note

HT_AN_SHTxx_Assembly_of_SMD_Packages , which

can be found on the Sensirion webpage.

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