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C1003_C0G • 3/30/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

•SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206

•AllotherEIAcasesizesarelimitedtosolderreflowonly

Recommended Reflow Soldering Profile:

KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),convection,

IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermalstress.KEMET’s

recommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J-STD-020standardformoisture

sensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpassesattheseconditions.

Profile Feature

Termination Finish

SnPb

100%MatteSn

Preheat/Soak

100°C

150°C

150°C

200°C

60–120seconds

60–120seconds

3°C/secondmaximum 3°C/secondmaximum

183°C

217°C

60–150seconds

60–150seconds

235°C

260°C

TimeWithin5°CofMaximum

20secondsmaximum 30secondsmaximum

Time25°CtoPeak

Temperature

6minutesmaximum

8minutesmaximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

25° C to Peak

25

Maximum Ramp Up Rate = 3°C/sec

Maximum Ramp Down Rate = 6°C/sec