Data Sheet

ADP2360

Rev. 0 | Page 15 of 15

OUTLINE DIMENSIONS

2.54

2.44

2.34

0.45

0.40

0.35

TOP VIEW

8

1

5

4

0.35

0.30

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.20 MIN

0.05 MAX

0.02 NOM

0.65 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.20)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

3.10

3.00 SQ

2.90

Figure 28. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-19)

Dimensions shown in millimeters

ORDERING GUIDE

Output Voltage

Temperature Range

Package Description

Package Option

ADP2360ACPZ-R7

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-19

ADP2360ACPZ-3.3-R7

3.3 V fixed

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-19

ADP2360ACPZ-5.0-R7

5.0 V fixed

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-19

ADP2360CP-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D13944-0-5/16(0)