P9038 DATASHEET

©2016 Integrated Device Technology, Inc.

2

P9038 August 1, 2016

Absolute Maximum Ratings

Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9038. These ratings, which

are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any

other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the

recommended operating temperature range.

Table 1: Absolute Maximum Ratings Summary.

(All voltages are referred to ground.)

NOTES:

and the device will enter thermal shutdown.

2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.

3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.

Table 3: ESD Information

Pins

Rating

Units

VBUS_SNS

-0.3 to 27

V

EN, IN, REG_IN, SW1, SW2, ISNSN_IN, ISNSP_IN

-0.3 to 12.5

V

GPIO_6:0, SCL, SDA, RESET, DP, DM, NC, NC1, NC2, NC3, SHIELD2, LDO5V, LDO2P5V_IN,

INV5V_IN, VFOD_SNS, ISNS, HPF, OVP_SEL, ISNS_V

-0.3 to 5.5

V

BST1, BST2

-0.3 to SW+6

V

GATE

-0.3 to REG_IN+6

V

GND, REFGND, PGND1, PGND2

+0.3

V

SHIELD1

-0.3 to 8

V

LDO2P5V

-0.3 to 2.75

V

Symbol

Description

Rating (VFQFPN)

Units

Thermal Resistance Junction to Ambient

25.5

C/W

Thermal Resistance Junction to Case

8.6

C/W

Thermal Resistance Junction to Board

2.4

C/W

Operating Junction Temperature

-40 to +125

C

Ambient Operating Temperature

-40 to +85

C

Storage Temperature

-55 to +150

C

Lead Temperature (soldering, 10s)

+300

C

Test Model

Pins

Ratings

Units

HBM

All pins

±2000

V

CDM

All pins

±500

V