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ADA4530-1R-EBZ 데이터시트(PDF) 4 Page - Analog Devices |
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ADA4530-1R-EBZ 데이터시트(HTML) 4 Page - Analog Devices |
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4 / 14 page ![]() UG-865 ADA4530-1R-EBZ User Guide Rev. 0 | Page 4 of 14 BOARD LAYERS STACKUP Figure 4. Board Layer Stackup The ADA4530-1R-EBZ is a 4-layer evaluation board that uses the Rogers 4350B, a high performance PCB laminate. A hybrid stackup is required for mechanical strength. The top and bottom layers are ceramic (Rogers 4350B) while the middle core layer is a conventional glass epoxy laminate (FR-4). The Rogers 4350B material provides superior insulation resistance in the presence of humidity compared to glass/epoxy materials. It minimizes current leakage and, therefore, increases signal integrity. Additionally, the dielectric relaxation times of Rogers 4350B are much shorter than glass/epoxy dielectrics. For more information on dielectric relaxation, see the ADA4530-1 data sheet. |
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