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ADM7170ACPZ-2.5-R7 데이터시트(PDF) 22 Page - Analog Devices

부품명 ADM7170ACPZ-2.5-R7
상세설명  Adjustable and fixed output voltage options
PDF  24 Pages
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ADM7170ACPZ-2.5-R7 데이터시트(HTML) 22 Page - Analog Devices

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Data Sheet
ADM7170
Rev. C | Page 21 of 23
Figure 64. LFCSP, TA = 50°C
Figure 65. LFCSP, TA = 85°C
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(5)
Figure 66. LFCSP Power Dissipation for Various Board Temperatures
TYPICAL APPLICATIONS CIRCUITS
Figure 67. Clock Driver
Figure 68. RF PLL/VCO Power
TOTAL POWER DISSIPATION (W)
1.8
2.0
2.2
2.4
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
60
70
80
90
100
110
120
140
160
130
150
6400mm2
500mm2
25mm2
TJ MAX
TOTAL POWER DISSIPATION (W)
1.5
0.8 0.9 1.0 1.1 1.2 1.3 1.4
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
65
75
85
95
105
115
125
135
155
145
6400mm2
500mm2
25mm2
TJ MAX
TOTAL POWER DISSIPATION (W)
9
8
7
6
5
4
3
2
1
0
0
160
140
120
100
80
60
40
20
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
ADM7170
6.5V, 500mA
LDO
4V TO 6.5V
3.3V
HIGH
SPEED
CLOCK
DRIVER
ADM7170
6.5V, 500mA
LDO
4V TO 6.5V
3.3V
VVCO
ADM7170
6.5V, 500mA
LDO
3.3V
AVDD
DVDD
ADF4350



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