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MBD301G 데이터시트(PDF) 1 Page - ON Semiconductor |
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MBD301G 데이터시트(HTML) 1 Page - ON Semiconductor |
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1 / 5 page ![]() © Semiconductor Components Industries, LLC, 1994 October, 2016 − Rev. 8 1 Publication Order Number: MBD301/D MBD301G, MMBD301LT1G, MMBD301LT3G, SMMBD301LT3G Silicon Hot-Carrier Diodes Schottky Barrier Diodes These devices are designed primarily for high−efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied in an inexpensive plastic package for low−cost, high−volume consumer and industrial/commercial requirements. They are also available in a Surface Mount package. Features • Extremely Low Minority Carrier Lifetime − 15 ps (Typ) • Very Low Capacitance − 1.5 pF (Max) @ VR = 15 V • Low Reverse Leakage − IR = 13 nAdc (Typ) MBD301, MMBD301 • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 30 V Forward Current (DC) IF 200 (Max) mA Total Device Dissipation @ TA = 25°C MBD301G MMBD301LT1G, MMBD301LT3G, SMMBD301LT3G Derate above 25 °C MBD301G MMBD301LT1G, MMBD301LT3G, SMMBD301LT3G PF 280 200 2.8 2.0 MW mW/ °C Operating Junction Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ORDERING INFORMATION 30 VOLTS SILICON HOT−CARRIER DETECTOR AND SWITCHING DIODES SOT−23 (TO−236) CASE 318 STYLE 8 3 CATHODE 1 ANODE 2 CATHODE 1 ANODE TO−92 2−Lead CASE 182 STYLE 1 SOT−23 TO−92 MARKING DIAGRAMS *Date Code orientation and/or overbar may vary depending upon manufacturing location. 1 4T M G G A = Assembly Location Y = Year W = Work Week 4T = Device Code (SOT−23) M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) MBD 301 AYW G G SOT−23 TO−92 www.onsemi.com |
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