TM

Suffix ThickneSS

(prior To Tinning)

flaTneSS &

paralleliSM

hoT

face

cold

face

lead

lengTh

l

0.126”± 0.010”

0.0015” / 0.0015” Lapped

Lapped

4.5”

l1

0.126”± 0.001”

0.001” / 0.001”

Lapped

Lapped

4.5”

l2

0.126”± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

4.5”

MM

0.134”± 0.010”

0.002” / 0.002”

Metallized

Metallized

4.5”

Suffix SealanT color TeMp range deScripTion

rT

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

ep

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

Innovative Technology

for a Connected World

SH Series SH10,125,05

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FeatureS

• Center hole

• Precise temperature Control

• Reliable solid state operation

• No sound or vibration

• DC operation

• RoHS compliant

applicationS

• Analytical instrumentation

• Clinical diagnostics

• Photonics laser systems

• Industrial instrumentation

• Food & beverage cooling

• Consumer appliances

The SH Series is an annular-style thermoelectric module (TEM). The hot and cold side

ceramics have a circular hole in the center to accommodate light protrusion

for optics, mechanical fastening or temperature probe.

This product line is available in multiple configurations. Assembled with Bismuth

Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics,

the SH Series is designed for higher current and larger heat-pumping applications.

perforMance SpecificaTionS

hot Side Temperature (°c)

25

50

Qmax (Watts)

33.7

37.0

delta Tmax (°c)

67

75

imax (amps)

4.0

4.0

Vmax (Volts)

14.3

16.2

Module resistance (ohms)

3.30

3.72

Sealing option