TMP93CS45F datasheet(39/48 Pages) TOSHIBA

39 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-39

2002-02-20

4.3.12 Electromagnetic Interference

Widespread use of electrical and electronic equipment in recent years has

brought with it radio and TV reception problems due to electromagnetic

interference. To use the radio spectrum effectively and to maintain radio

communications quality, each country has formulated regulations limiting the

amount of electromagnetic interference which can be generated by individual

products.

Electromagnetic interference includes conduction noise propagated through

power supply and telephone lines, and noise from direct electromagnetic

waves radiated by equipment. Different measurement methods and corrective

measures are used to assess and counteract each specific type of noise.

Difficulties in controlling electromagnetic interference derive from the fact

that there is no method available which allows designers to calculate, at the

design stage, the strength of the electromagnetic waves which will emanate

from each component in a piece of equipment. For this reason, it is only after

the prototype equipment has been completed that the designer can take

measurements using a dedicated instrument to determine the strength of

electromagnetic interference waves.

Yet it is possible during system design to incorporate some measures for the

prevention of electromagnetic interference, which can facilitate taking

corrective measures once the design has been completed. These include

installing shields and noise filters, and increasing the thickness of the power

supply wiring patterns on the printed circuit board. One effective method, for

example, is to devise several shielding options during design, and then select

the most suitable shielding method based on the results of measurements

taken after the prototype has been completed.

4.3.13 Peripheral Circuits

In most cases semiconductor devices are used with peripheral circuits and

components. The input and output signal voltages and currents of these

circuits must be chosen to match the semiconductor device’s specifications.

The following factors must be taken into account.

(1)

Inappropriate voltages or currents applied to a device’s input pins may

cause it to operate erratically. Some devices contain pull-up or pull-down

resistors. When designing your system, remember to take the effect of this

on the voltage and current levels into account.

(2)

The output pins on a device have a predetermined external circuit drive

capability. If this drive capability is greater than that required, either

incorporate a compensating circuit into your design or carefully select

suitable components for use in external circuits.

4.3.14 Safety Standards

Each country has safety standards which must be observed. These safety

standards include requirements for quality assurance systems and design of

device insulation. Such requirements must be fully taken into account to

ensure that your design conforms to the applicable safety standards.

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