LP2987 datasheet(10/24 Pages) NSC

10 / 24 page

Electrical Characteristics (Continued)

Limits in standard typeface are for T

J = 25˚C, and limits in boldface type apply over the full operating temperature range. Un-

less otherwise specified: V

IN =VO(NOM) + 1V, IL = 1 mA, COUT = 4.7 µF, CIN = 2.2 µF, VS/D = 2V.

Symbol

Parameter

Conditions

Typical

LM2987/8AI-X.X

(Note 6)

LM2987/8I-X.X

(Note 6)

Units

Min

Max

Min

Max

Output Voltage

Temperature Coefficient

(Note 9)

ppm/˚C

DELAY

Delay Pin Current

Source

2.2

1.6

2.8

1.6

2.8

µA

1.4

3.0

1.4

3.0

SHUTDOWN INPUT

S/D

S/D Input Voltage

(Note 8)

H = O/P ON

1.4

1.6

L = O/P OFF

0.55

0.18

S/D

S/D Input Current

S/D =0

−1

µA

S/D =5V

ERROR COMPARATOR

Output “HIGH” Leakage

OH = 16V

0.01

µA

Output “LOW” Voltage

IN =VO(NOM) − 0.5V,

O(COMP) = 300 µA

150

220

350

THR

(MAX)

Upper Threshold Voltage

−4.6

−5.5

−3.5

−5.5

−3.5

OUT

−7.7

−2.5

−7.7

−2.5

THR

(MIN)

Lower Threshold Voltage

−6.6

−8.9

−4.9

−8.9

−4.9

−13.0

−3.3

−13.0

−3.3

HYST

Hysteresis

2.0

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the

device outside of its rated operating conditions.

Note 2: The ESD rating of the Bypass pin is 500V (LP2988 only.)

Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJ−A,

and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:

The value of

θJ−A for the SO-8 (M) package is 160˚C/W, and the mini SO-8 (MM) package is 200˚C/W. The value θJ−A for the LLP (LD) package is specifically

dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the LLP

package, refer to Application Note AN-1187. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into

thermal shutdown.

Note 4: If used in a dual-supply system where the regulator load is returned to a negative supply, the LM2987/8 output must be diode-clamped to ground.

Note 5: The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Forcing the output above the input will turn

on this diode and may induce a latch-up mode which can damage the part (see Application Hints).

Note 6: Limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control

(SQC) methods. The limits are used to calculate National’s Average Outgoing Quality Level (AOQL).

Note 7: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a 1V differential.

Note 8: To prevent mis-operation, the Shutdown input must be driven by a signal that swings above VH and below VL with a slew rate not less than 40 mV/µs (see

Application Hints).

Note 9: Temperature coefficient is defined as the maximum (worst-case) change divided by the total temperature range.

Note 10: See Typical Performance Characteristics curves.

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