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FT221XS-R 데이터시트(PDF) 38 Page - Future Technology Devices International Ltd. |
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FT221XS-R 데이터시트(HTML) 38 Page - Future Technology Devices International Ltd. |
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38 / 45 page ![]() Copyright © 2013 Future Technology Devices International Limited 38 FT221X USB 8-BIT SPI/FT1248 IC Datasheet Version 1.3 Document No.: FT_000630 Clearance No.: FTDI# 263 10.3 QFN-20 Package Mechanical Dimensions Figure 10.3 QFN-20 Package Dimensions The FT221XQ is supplied in a RoHS compliant leadless QFN-20 package. The package is lead (Pb) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. The above mechanical drawing shows the QFN-32 package. All dimensions are in millimetres. The centre pad on the base of the FT221XQ is internally connected to GND, and the PCB should not have signal tracks on the top layer under this device. |
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