FT230XQ-R datasheet(35/44 Pages) FTDI

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FT230XQ-R 데이터시트(PDF) 35 Page - Future Technology Devices International Ltd.

부품명	FT230XQ-R

상세설명	Future Technology Devices International Ltd.

PDF	44 Pages

Scroll/Zoom	100%

제조업체	FTDI [Future Technology Devices International Ltd.]

홈페이지	http://www.ftdichip.com

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35 / 44 page

FT230X USB TO BASIC UART IC

Version 1.4

Document No.: FT_000566 Clearance No.: FTDI# 260

9 Package Parameters

The FT230X is available in two different packages. The FT230XS is the SSOP-16 option and the FT230XQ

is the QFN-16 package option. The solder reflow profile for both packages is described in Section 9.4.

9.1 SSOP-16 Package Mechanical Dimensions

Figure 9.1 SSOP-16 Package Dimensions

The FT230XS is supplied in a RoHS compliant 16 pin SSOP package. The package is lead (Pb) free and

uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The pins are on a

0.635 mm pitch. The above mechanical drawing shows the SSOP-16 package.

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