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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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BAL-NRF02D3 데이터시트(PDF) 9 Page - STMicroelectronics |
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BAL-NRF02D3 데이터시트(HTML) 9 Page - STMicroelectronics |
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9 / 11 page  BAL-NRF02D3 Package information DocID024794 Rev 6 9/11 Figure 14: Footprint - 3 mils stencil -non solder mask defined Figure 15: Footprint - 3 mils stencil - solder mask defined Figure 16: Footprint - 5 mils stencil -non solder mask defined Figure 17: Footprint - 5 mils stencil - solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Solder stencil opening: 220 µm recommended Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended *depending on paste, it can go down to 270 µm Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Solder stencil opening: 330 µm recommended* *depending on paste, it can go down to 270 µm Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum Solder stencil opening: 330 µm recommended* |
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