Typical Application Circuits

(Continued)

with the DDR-SDRAM DIMMs mounted on modules. As a

result bulk aluminum electrolytic capacitors in the range of

1000uF are typically used.

PCB Layout Considerations

1.

The input capacitor for the power rail should be placed

as close as possible to the PVIN pin.

2.

V

at the point where regulation is required. For mother-

board applications an ideal location would be at the

center of the termination bus.

3.

V

at either the DIMM or the Chipset. This provides the

most accurate point for creating the reference voltage.

4.

For improved thermal performance excessive top side

copper should be used to dissipate heat from the pack-

age. Numerous vias from the ground connection to the

internal ground plane will help. Additionally these can be

located underneath the package if manufacturing stan-

dards permit.

5.

Care should be taken when routing the V

avoid noise pickup from switching I/O signals. A 0.1uF

ceramic capacitor located close to the V

be used to filter any unwanted high frequency signal.

This can be an issue especially if long V

used.

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