MP33AB01 datasheet(8/13 Pages) STMICROELECTRONICS

8 / 13 page

Package mechanical data

MP33AB01

8/13

DocID24159 Rev 2

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Soldering information

The RHLGA (3.76 x 2.95) mm package is also compliant with the RoHS and “Green”

standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

Figure 4. Recommended soldering profile limits

Table 6. Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

TL to TP

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

Time (TSMIN to TSMAX)

TSMIN

TSMAX

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

TSMAX to TL

Time maintained above liquidous temperature

Liquidous temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

T25°C to PEAK

RAMP-DOWN

RAMP-UP

PREHEAT

CRITICAL ZONE

L to T P

SMAX

SMIN

TIME

120

150

180

210

240

270

300

330

360

390

AM045166v1

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