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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32L476RG 데이터시트(PDF) 222 Page - STMicroelectronics |
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STM32L476RG 데이터시트(HTML) 222 Page - STMicroelectronics |
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222 / 232 page  Package information STM32L476xx 222/232 DocID025976 Rev 4 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 63. WLCSP72 marking (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 111. WLCSP72 recommended PCB design rules (0.4 mm pitch BGA) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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