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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PC87570-ICC/VUL 데이터시트(PDF) 132 Page - National Semiconductor (TI) |
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PC87570-ICC/VUL 데이터시트(HTML) 132 Page - National Semiconductor (TI) |
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132 / 168 page  Device Specifications 132 www.national.com 19.0 Device Specifications This chapter provides power and grounding guidelines, specifies the maximum ratings and the electrical character- istics of the PC87570, and describes its timing. 19.1 POWER AND GROUNDING The PC87570 requires either a 5V +/- 10% or a 3.3V +/- 10% supply to all four VCC pins. The digital ground pins of the PC87570 are marked GND. The RTC backup battery is connected between VBAT and GND. The PC87570 includes an internal resistor between the battery input and the power switch, for UL protection. The on-chip analog circuits have a separate supply pin (marked AVCC) and ground pin (marked AGND). Warning The AVCC and AGND pins must have the same voltage as the VCC and GND of the digital section, respec- tively. The chip should never be operated with only one of the power supplies connected, else irreversible damage may occur. To reduce EMI and ground bounce, place a 0.1 µF capacitor between each VCC and GND pair as close as possible to the PC87570 pins. Figure 19-1. Power and Ground Connections 19.2 GENERAL DC ELECTRICAL CHARACTERISTICS 19.2.1 Recommended Operating Conditions Table 19-1. Recommended Operating Conditions at 5 V ±10% Table 19-2. Recommended Operating Conditions at 3.3 V ±10% Parameter Symbol Min Typical Max Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Temperature TA 0 +70 ° C Parameter Symbol Min Typical Max Unit Supply Voltage VCC 3.0 3.3 3.6 V Operating Temperature TA 0 +70 ° C VCC GND Digital Digital PC87570 Analog AVCC CF BT1 0.1 µF 1. Place a 0.1 µF capacitor on each V CC power supply pin as close as possible to the pin, and also on VBAT. 2. Place a 10-47 µF capacitor on the common digital power supply net, as close as possible to the device. CF 0.1 µF AGND Analog Power Power Ground Ground VBAT GND CF 0.1 µF Digital Ground |
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