| 전자부품 데이터시트 검색엔진 |
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LNBP8L 데이터시트(PDF) 12 Page - STMicroelectronics |
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LNBP8L 데이터시트(HTML) 12 Page - STMicroelectronics |
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12 / 21 page ![]() Detailed description and application hints LNBP8L - LNBP9L - LNBP10L - LNBP11L 12/21 Several clips can be used depending on the heat sink type: ● Saddle clips (Figure 7) for slim heat sinks ● U-clips (Figure 8) for thick heat sinks ● Dedicated clips for special shaped heat sinks Note that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to that of the SOT- 32 and SOT-82 (2.55 +/- 0.15 mm). The same clips can also be used for these packages. The junction-to-ambient thermal resistance for the IPPAK can be calculated as follows: RTH-JA = RTH-JC + RTH-CH + RTH-HA where: RTH-JC is the junction-to-case thermal resistance of the IPPAK (see Table 4: Thermal data ), RTH-CH is the case-to-heat sink thermal resistance and the RTH-HA is the heat sink-to- air thermal resistance. Figure 7. IPPAK mounted with a saddle clip. Figure 8. IPPAK mounted with a U-clip. |
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