SPC560B64X datasheet(86/133 Pages) STMICROELECTRONICS

86 / 133 page

Electrical characteristics

SPC560B54x/6x

86/133

DocID15131 Rev 9

4.10.3

Start-up/Switch-off timings

4.11

Electromagnetic compatibility (EMC) characteristics

Susceptibility tests are performed on a sample basis during product characterization.

4.11.1

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Table 32. Flash power supply DC electrical characteristics

Symbol

Parameter

Conditions(1)

Value

Unit

Min

Typ

Max

ICFREAD

Sum of the current consumption on

VDD_HV and VDD_BV on read access

Flash module read

fCPU = 64 MHz

Code Flash

—

IDFREAD

Data Flash

—

ICFMOD

Sum of the current consumption on

VDD_HV and VDD_BV on matrix

modification (program/erase)

Program/Erase

on-going while reading

Flash registers

fCPU = 64 MHz

Code Flash

—

IDFMOD

Data Flash

—

ICFLPW

Sum of the current consumption on

VDD_HV and VDD_BV during Flash low

power mode

—

Code Flash

—

1.1

IDFLPW

Data Flash

—

900

µA

ICFPWD

Sum of the current consumption on

VDD_HV and VDD_BV during Flash

power down mode

—

Code Flash

—

150

µA

IDFPWD

Data Flash

—

150

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C, unless otherwise specified.

Table 33. Start-up time/Switch-off time

Symbol

Parameter

Conditions(1)

Value

Unit

Min

Typ

Max

tFLARSTEXIT

CC T Delay for Flash module to exit reset mode

—

125

µs

tFLALPEXIT

CC T Delay for Flash module to exit low-power mode

—

0.5

tFLAPDEXIT

CC T Delay for Flash module to exit power-down mode

—

tFLALPENTRY

CC T Delay for Flash module to enter low-power mode

—

0.5

tFLAPDENTRY CC T Delay for Flash module to enter power-down mode

—

1.5

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified.

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