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STM32F042X4 데이터시트(PDF) 93 Page - STMicroelectronics |
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STM32F042X4 데이터시트(HTML) 93 Page - STMicroelectronics |
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93 / 117 page ![]() DocID025832 Rev 5 93/117 STM32F042x4 STM32F042x6 Package information 113 7.2 UFQFPN48 package information UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 36. UFQFPN48 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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