STM32L162VE datasheet(122/129 Pages) STMICROELECTRONICS

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STM32L162xE

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DocID025882 Rev 6

Figure 40. WLCSP104, 0.4 mm pitch wafer level chip scale package recommended

footprint

Table 68. WLCSP104, 0.4 mm pitch wafer level chip scale package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.525

0.555

0.585

0.0207

0.0219

0.023

0.175

0.0069

0.38

0.015

A3(2)

2. Back side coating.

0.025

0.001

ø b(3)

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.22

0.25

0.28

0.0087

0.0098

0.011

4.06

4.095

4.13

0.1598

0.1612

0.1626

5.059

5.094

5.129

0.1992

0.2006

0.2019

0.4

0.0157

3.2

0.126

4.4

0.1732

0.447

0.0176

0.347

0.0137

aaa

0.1

0.0039

bbb

0.1

0.0039

ccc

0.1

0.0039

ddd

0.05

0.002

eee

0.05

0.002

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