STM32F732ICK6 datasheet(11/122 Pages) STMICROELECTRONICS

11 / 122 page

DocID028480 Rev 1

11/122

STM32F732xx STM32F733xx

Description

Maximum CPU frequency

216 MHz(7)

Operating voltage

1.7 to 3.6 V(8)

Operating temperatures

Ambient temperatures: –40 to +85 °C /–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package

LQFP64(9)

LQFP100(9)

WLCSP100(10)

LQFP144

UFBGA144(10)

UFBGA176

LQFP176

1. For the LQFP100 package, only FMC Bank1 is available. Bank1 can only support a multiplexed NOR/PSRAM memory

using the NE1 Chip Select.

2. On the STM32F733xx device packages, except the 176-pin ones, the TIM12 is not available, so there are 9 general-

purpose timers.

3. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio

mode.

4. USB OTG HS with the ULPI in the STM32F732xx devices and with integrated HS PHY in the STM32F733xx devices.

5. The SDMMC2 supports a dedicated power rail for clock, command and data 0..4 lines, feature available starting from 144

pin package.

6. The SDMMC2 is not available on the STM32F733Vx devices.

7. 216 MHz maximum frequency for - 40°C to + 85°C ambient temperature range (200 MHz maximum frequency for - 40°C to

+ 105°C ambient temperature range).

8. VDD/VDDA minimum value of 1.7 V is obtained when the internal reset is OFF (refer to Section 2.15.2: Internal reset OFF).

9. Available only on the STM32F732xx devices.

10. Available only on the STM32F733xx devices.

Table 2. STM32F732xx and STM32F733xx features and peripheral counts (continued)

Peripherals

STM32F73xRx

STM32F73xVx

STM32F73xZx

STM32F73xIx

STM32F732ICK6 데이터시트(PDF) 11 Page - STMicroelectronics