REV. A

ADF4210/ADF4211/ADF4212/ADF4213

–19–

PCB Guidelines for Chip Scale Package

The lands on the chip scale package (CP-20), are rectangular.

The printed circuit board pad for these should be 0.1 mm

longer than the package land length and 0.05 mm wider than

the package land width. The land should be centered on the

pad. This will ensure that the solder joint size is maximized.

The bottom of the chip scale package has a central thermal pad.

The thermal pad on the printed circuit board should be at least

as large as this exposed pad. On the printed circuit board, there

should be clearance of at least 0.25 mm between the thermal

pad and inner edges of the pad pattern. This will ensure that

shorting is avoided.

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Thin Shrink Small Outline Package (TSSOP)

(RU-20)

20

11

10

1

0.256 (6.50)

0.246 (6.25)

0.177 (4.50)

0.169 (4.30)

PIN 1

0.260 (6.60)

0.252 (6.40)

SEATING

PLANE

0.006 (0.15)

0.002 (0.05)

0.0118 (0.30)

0.0075 (0.19)

0.0256 (0.65)

BSC

0.0433 (1.10)

MAX

0.0079 (0.20)

0.0035 (0.090)

0.028 (0.70)

0.020 (0.50)

8

0

Chip Scale Package

(CP-20)

1

20

5

6

11

16

15

BOTTOM

VIEW

10

0.080 (2.25)

0.083 (2.10) SQ

0.077 (1.95)

0.024 (0.60)

0.017 (0.42)

0.009 (0.24)

0.024 (0.60)

0.017 (0.42)

0.009 (0.24)

0.030 (0.75)

0.022 (0.60)

0.014 (0.50)

0.012 (0.30)

0.009 (0.23)

0.007 (0.18)

0.080 (2.00)

REF

0.010 (0.25)

MIN

0.020 (0.50)

BSC

12 MAX

0.008 (0.20)

REF

0.031 (0.80) MAX

0.026 (0.65) NOM

0.002 (0.05)

0.0004 (0.01)

0.0 (0.0)

0.035 (0.90) MAX

0.033 (0.85) NOM

SEATING

PLANE

CONTROLLING DIMENSIONS ARE IN MILLIMETERS

PIN 1

INDICATOR

TOP

VIEW

0.148 (3.75)

BSC SQ

0.157 (4.0)

BSC SQ

Thermal vias may be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they should be incorporated in the thermal pad at 1.2 mm

grid pitch. The via diameter should be between 0.3 mm and

0.33 mm and the via barrel should be plated with 1 oz. copper

to plug the via. The user should connect the printed circuit

board pad to AGND.