DocID024952 Rev 4

9/12

HSP051-4M10

Recommendation on PCB assembly

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can lead to insufficient contact between package and solder paste that could cause

open solder joints or badly centered packages.

5.

To improve the package placement accuracy, a bottom side optical control should be

performed with a high resolution tool.

6.

For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is

recommended during solder paste printing, pick and place and reflow soldering by

using optimized tools.

3.3

PCB design

1.

To control the solder paste amount, the closed via is recommended instead of open

vias.

2.

The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

Figure 21. Printed circuit board layout recommendations

Via to

GND

Via to

GND

500 µm

Footprint pad

PCB tracks

1

5

6

10