P3602ACMC datasheet(185/212 Pages) TECCOR

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SIDACtor Soldering Recommendations

5 - 23

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SIDACtor® Data Book and Design Guide

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not exceed 275 °C and the maximum temperature of the plastic body does not exceed

250 °C. (Figure 5.8)

Figure 5.7 Principle of Vapor Phase Soldering

Figure 5.8 Reflow Soldering Profile

During reflow, the surface tension of the liquid solder draws the leads of the device towards

the center of the soldering area, correcting any misalignment that may have occurred

during placement and allowing the device to set flush on the pad. If the footprints of the pad

are not concentrically aligned, the same effect can result in undesirable shifts as well.

Therefore, it is important to use a standard contact pattern which leaves sufficient room for

self-positioning.

After the solder cools, connections should be visually inspected and remnants of the flux

removed using a vapor degreaser with an azeotrope solvent or equivalent.

Transport

Cooling pipes

PC board

Heating

elements

Boiling liquid (primary medium)

Vapor phase

zone

Vapor lock

(secondary

medium)

Time (Seconds)

100

120

140

160

180

200

220

240

120

150

180

210

240

270

300

Pre-heat

Soak

Reflow

Cool

Down

0.5 - 0.6 ˚C/s

1.3 - 1.6 ˚C/s

<2.5 ˚C/s

Peak Temperature

220 ˚C - 245 ˚C

Soaking Zone

Reflow Zone

Pre-heating Zone

( 2 min. MAX )

60 - 90 s typical

( 2-4 min MAX )

( 2 min. MAX )

30 - 60 s typical

260

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