HT45F4N datasheet(17/170 Pages) HOLTEK

17 / 170 page

Rev. 1.30

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Rev. 1.30

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HT45F4N/HT45FH4N

Power Bank Flash MCU

HT45F4N/HT45FH4N

Power Bank Flash MCU

Internal Connection Description

Signal Name

Function

OPT

I/T

O/T

Pin-shared Mapping

PB3 ~ PB�

Gene�al pu�pose input/output. Registe� ena�led

pull-up.

Inte�nally �onne�ted to the level shift inputs

�espe�tively.

PBPU ST CMOS

—

OUT0L� OUT0H PWM output

Inte�nally �onne�ted to the level shift inputs A and C TMPC — CMOS PB�� PB3

A� C

Level shift inputs.

Inte�nally �onne�ted to PB�/OUT0L and PB3/

OUT0H �espe�tively

—

Note:I/T:Inputtype;

O/T:Outputtype

OPT:Optionalbyconfigurationoption(CO)orregisteroption

PWR:Power;

ST:SchmittTriggerinput

CMOS:CMOSoutput;

AN:Analoginputpin

SCOM:SoftwarecontrolledLCDCOM

Level Shift Input/Output Relationship and Reset Condition

Level Shift Output

Level Shift Input

Reset State

A input = Low

A input = High

AX� BX

Low

High

Level Shift Output

Level Shift Input

Reset State

C input = Low

C input = High

CX� DX

High

Low

Absolute Maximum Ratings

SupplyVoltage................................................................................................VSS−0.3VtoVSS+6.0V

InputVoltage..................................................................................................VSS−0.3VtoVDD+0.3V

StorageTemperature....................................................................................................-50˚Cto150˚C

OperatingTemperature..................................................................................................-40˚Cto85˚C

IOLTotal................................................................................................................................... 120mA

IOHTotal..................................................................................................................................-120mA

TotalPowerDissipation......................................................................................................... 500mW

Note:Thesearestressratingsonly.Stressesexceedingtherangespecifiedunder"AbsoluteMaximum

Ratings"maycausesubstantialdamagetothesedevices.Functionaloperationofthesedevicesat

otherconditionsbeyondthoselistedinthespecificationisnotimpliedandprolongedexposureto

extremeconditionsmayaffectdevicesreliability.

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