| 전자부품 데이터시트 검색엔진 |
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HT16E07 데이터시트(PDF) 3 Page - Holtek Semiconductor Inc |
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HT16E07 데이터시트(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 31 page ![]() Rev. 1.00 3 June 19, 2017 HT16E07 Pad Dimensions Item Pad Number Size Unit X Y Chip size — 4228 850 μm Chip thickness — 508 ± 38 μm Pad pitch 1, 38 ~ 166 27 μm 3 ~ 35, 37 > 86 μm Bump size 1, 38 ~ 166 15 126 μm 3 ~ 35, 37 68 68 μm Bump height All pad 18 ± 3 μm Alignment Mark Dimensions Item Number Size Unit ALIGN_A 2 40μm 20μm 40μm 20μm (X, Y) 10μm 10μm μm ALIGN_B 36 20μm 20μm 20μm 20μm 40μm (X, Y) 10μm 10μm μm |
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