PRELIMINARY TECHNICAL DATA

REV. PrD

ADG3247

–11–

OUTLINE DIMENSIONS

40-Lead Frame Chip Scale Package [LFCSP]

(CP-40)

Dimensions shown in millimeters

1

40

10

11

31

30

21

20

BOTTOM

VIEW

4.25

3.70 SQ

1.75

TOP

VIEW

6.00

BSC SQ

PIN 1

INDICATOR

5.75

BSC SQ

12 MAX

0.30

0.23

0.18

0.20 REF

SEATING

PLANE

1.00

0.90

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

1.00 MAX

0.65 NOM

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

38-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-38)

Dimensions shown in millimeters

38

20

19

1

9.80

9.70

9.60

PIN 1

SEATING

PLANE

0.15

0.05

0.50

BSC

1.20

MAX

0.27

0.17

0.20

0.09

8

0

4.50

4.40

4.30

6.40 BSC

0.70

0.60

0.45

COMPLIANT TO JEDEC STANDARDS MO-153BD-1

COPLANARITY

0.10