XZFAMYK10C2 datasheet(1/4 Pages) SUNLED

부품명	XZFAMYK10C2

상세설명	Low power consumption

PDF	4 Pages

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제조업체	SUNLED [SunLED Corporation]

홈페이지	http://www.sunled.com

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1 / 4 page

Part Number: XZFAMYK10C2

SURFACE MOUNT DISPLAY

Oct 17,2016

XDSB1621 V4-X Layout: Maggie L.

P. 1/4

Features

● 0.4 inch digit height

● Robust package

● Low power consumption

● Standard configuration: Gray face w/ white

segments

● Standard Package: 250pcs/ Reel

● MSL (Moisture Sensitivity Level): 2a

● RoHS Compliant

Absolute Maximum Ratings

(TA=25°C)

Yellow

(AlGaInP)

Unit

Reverse Voltage

VR

5

V

Forward Current

IF

30

mA

Forward Current (Peak)

1/10 Duty Cycle

0.1ms Pulse Width

iFS

175

mA

Power Dissipation

PD

75

mW

Operating Temperature

TA

-40 ~ +85

°C

Storage Temperature

Tstg

-40 ~ +85

Package Schematics

Notes:

1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.

2. Specifications are subject to change without notice.

3.The gap between the reflector and PCB shall not exceed 0.25mm.

Part

Number

Emitting

Color

Emitting

Material

Wavelength

CIE127-2007*

nm

λP

Description

min.

typ.

XZFAMYK10C2

Yellow

AlGaInP

21000

5600*

45990

11990*

590*

Common Cathode,

Rt. Hand Decimal

Luminous Intensity

CIE127-2007*

(IF=10mA)

ucd

Yellow

(AlGaInP)

Unit

Forward Voltage (Typ.) (IF=10mA)

VF

1.95

V

Forward Voltage (Max.) (IF=10mA)

VF

2.5

V

Reverse Current (Max.) (VR=5V)

IR

10

uA

Wavelength of Peak

Emission CIE127-2007* (Typ.)

(IF=10mA)

λP

590*

nm

Wavelength of Dominant

Emission CIE127-2007* (Typ.)

(IF=10mA)

λD

590*

nm

Spectral Line Full Width

At Half-Maximum (Typ.)

(IF=10mA)

△

λ

20

nm

Capacitance (Typ.)

(VF=0V, f=1MHz)

C

20

pF

Operating Characteristics

(TA=25°C)

*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

DISCHARGE

SENSITIVE

DEVICES

A Relative Humidity between 40% and 60% is recommended in

ESD-protected work areas to reduce static build up during assembly

process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033)

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