Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Chip Resistor Arrays - Application Note

Component Placement

a. Reduce the mechanical stress to a minimum during and after placing of the unit in order not to damage the terminals and

protective coating.

b. Misplacement of components may cause solder bridges.

Soldering

a. Reflow soldering: Recommendation is shown in the following chart.

b. Wave soldering: Recommendation according to IEC standards.

c. Hand soldering: Don’t touch the protective coating of the part. Solder within 3 seconds when the temperature is over 280 ºC.

250

200

150

100

50

0

Preheating

Soldering

Gradual Cooling

60 sec. min.

10-30 sec.

120 sec. min.