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TUSB546A-DCI

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SLLSF14 – JUNE 2017

Product Folder Links: TUSB546A-DCI

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the GND terminals.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

4

V

Voltage Range at any input or output pin

Differential voltage between positive and

negative inputs

±2.5

V

Voltage at differential inputs

–0.5

V

CMOS Inputs

–0.5

V

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±5000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Main power supply

3

3.3

3.6

V

Supply Ramp Requirement

100

ms

Supply that external resistors are pulled up to on SDA and SCL

1.7

3.6

V

100

mV

Operating free-air temperature

TUSB546A-DCI

0

70

°C

TUSB546I-DCI

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TUSB546A-DCI

UNIT

RNQ (WQFN)

40 PINS

Junction-to-ambient thermal resistance

37.6

°C/W

Junction-to-case (top) thermal resistance

20.7

°C/W

Junction-to-board thermal resistance

9.5

°C/W

Junction-to-top characterization parameter

0.2

°C/W

Junction-to-board characterization parameter

9.4

°C/W

Junction-to-case (bottom) thermal resistance

2.3

°C/W