RT8409GS datasheet(10/11 Pages) RICHTEK

10 / 11 page

RT8409

DS8409-00

September 2016

www.richtek.com

is a registered trademark of Richtek Technology Corporation.

Figure 1. Derating Curve of Maximum Power Dissipation

0.0

0.1

0.2

0.3

0.4

0.5

0.6

100

125

Ambient Temperature (°C)

Two-Layer PCB

Layout Consideration

For best performance of the RT8409, the following layout

guidelines should be strictly followed.



The hold up capacitor, C1, must be placed as close as

possible to the VCC pin.



The compensation component C2 and R1, must be

placed as close as possible to the COMP pin.



The IC SOURCE pin are high frequency switching nodes.

The traces must be as wide and short as possible.



Keep the main traces with switching current as short

and wide as possible.



Place CIN, L1, R2, COUT, and D5 as close to each other

as possible.

Figure 2. PCB Layout Guide

Place the capacitor C1 as close as

possible to the VCC pin

VMAIN

CIN

Power GND

VOUT

COUT

Analog GND

RSTART

Place the compensation

Components C2 and R1 as

close as possible to the IC

Analog GND

VCC

Narrow trace from main circuit

to the IC to avoid the switching

noise

Place the Diode D5 and the resistor R2 as

close as possible to the SOURCE pin

R2B

R2A

Power GND

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