RT8900PC datasheet(5/11 Pages) RICHTEK

5 / 11 page

RT8900

DS8900-06

September 2011

www.richtek.com

Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended

periods may remain possibility to affect device reliability.

Note 2. For WQFN-20L 4x4,

θJA is measured in natural convection at TA = 25°C on a high-effective thermal conductivity four-layer

test board of JEDEC 51-7 thermal measurement standard. The measurement case position of

θJA is on the exposed

pad of the package. For TSSOP-20,

θJA is measured in natural convection at TA = 25°C on a low-effective thermal

conductivity single-layer test board of JEDEC 51-3 thermal measurement standard.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Note 5. Switch characteristics are guaranteed by design; not subject to production testing.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

High to Low Transition

(Note 5)

tPHL

VVGH1 = VVGH2 = 27V, VVGL = −7V

Rise Time

(Note 5)

VVGH1 = VVGH2 = 27V, VVGL = −7V

Fall Time

(Note 5)

VVGH1 = VVGH2 = 27V, VVGL = −7V

Maximum Operation Frequency fO

VVGH1 = VVGH2 = 27V, VVGL = −7V

100

kHz

Quiescent IVGH1

IVGH1

VVIN0 to 7 = 0 or 6V, No Load

μA

Quiescent IVGH2

IVGH2

VVIN0 to 7 = 0 or 6V, No Load

μA

Quiescent IVGL

IVGL

VVIN0 to 7 = 0 or 6V, No Load

μA

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