MPC7457 datasheet(10/68 Pages) FREESCALE

10 / 68 page

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

General Parameters

The following list provides a summary of the general parameters of the MPC7457:

Technology

0.13

µm CMOS, nine-layer metal

Die size

9.1 mm × 10.8 mm

Transistor count

58 million

Logic design

Fully-static

Packages

MPC7447: Surface mount 360 ceramic ball grid array (CBGA)

MPC7457: Surface mount 483 ceramic ball grid array (CBGA)

Core power supply

1.3 V ±50 mV DC nominal

I/O power supply

1.8 V ±5% DC, or

2.5 V ±5% DC, or

1.5 V ±5% DC (L3 interface only, not implemented on MPC7447)

Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7457.

5.1

DC Electrical Characteristics

The tables in this section describe the MPC7457 DC electrical characteristics.Table 2 provides the absolute

maximum ratings.

Table 2. Absolute Maximum Ratings 1

Characteristic

Symbol

Maximum Value

Unit

Notes

Core supply voltage

VDD

–0.3 to 1.60

PLL supply voltage

AVDD

–0.3 to 1.60

Processor bus supply voltage

BVSEL = 0

OVDD

–0.3 to 1.95

3, 4

BVSEL = HRESET or OVDD

OVDD

–0.3 to 2.7

3, 5

L3 bus supply voltage

L3VSEL = ¬HRESET

GVDD

–0.3 to 1.65

3, 6

L3VSEL = 0

GVDD

–0.3 to 1.95

3, 7

L3VSEL = HRESET or GVDD

GVDD

–0.3 to 2.7

3, 8

Input voltage

Processor bus

Vin

–0.3 to OVDD + 0.3

9, 10

L3 bus

Vin

–0.3 to GVDD + 0.3

9, 10

JTAG signals

Vin

–0.3 to OVDD + 0.3

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