µA741, µA741Y

GENERAL-PURPOSE OPERATIONAL AMPLIFIERS

SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

CHIP

TA

SMALL

OUTLINE

(D)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(J)

CERAMIC

DIP

(JG)

PLASTIC

DIP

(P)

TSSOP

(PW)

FLAT

PACK

(U)

CHIP

FORM

(Y)

0

°C to 70°C

µA741CD

µA741CP

µA741CPW

µA741Y

–40

°C to 85°C

µA741ID

µA741IP

–55

°C to 125°C

µA741MFK

µA741MJ

µA741MJG

µA741MU

The D package is available taped and reeled. Add the suffix R (e.g.,

µA741CDR).

schematic

IN –

IN+

VCC+

VCC –

OUT

OFFSET N1

OFFSET N2

Transistors

22

Resistors

11

Diode

1

Capacitor

1

Component Count