ABB2513 datasheet(7/8 Pages) ASB

7 / 8 page

7/8

ASB Inc.

 sales@asb.co.kr

August 2017

ABB2513

4. Package Outline (SOIC8)

5. Surface Mount Recommendation (In mm)

Symbols

Dimensions (In mm)

MIN

NOM

MAX

1.40

1.50

1.60

0.00

---

0.10

---

1.45

---

0.33

---

0.51

0.19

---

0.25

4.80

---

5.00

3.20

3.30

3.40

5.80

6.00

6.20

3.80

3.90

4.00

2.30

2.40

2.50

---

1.27

---

0.40

---

1.27

---

0.10





---



L1-L1

---

0.12

1.04REF

NOTE

1. Add as much copper as possible to inner and

outer layers near the part to ensure optimal

thermal performance.

2. To ensure reliable operation, device ground

paddle-to-ground pad soldering is critical.

3. Add mounting screws near the part to fasten the

board to a heat sinker. Ensure that the ground &

thermal via region contacts the heat sinker.

4. A proper heat dissipation path underneath the

area of the PCB for the mounted device is strictly

required for proper thermal operation. Damage to

the device can result from inappropriate heat

dissipation.

le is RF and DC ground.

Part No.

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