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MPXM2102AS 데이터시트(PDF) 293 Page - Motorola, Inc

부품명 MPXM2102AS
상세설명  Sensor
PDF  670 Pages
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제조업체  MOTOROLA [Motorola, Inc]
홈페이지  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPXM2102AS 데이터시트(HTML) 293 Page - Motorola, Inc

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MPXAZ6115A SERIES
3–147
Motorola Sensor Device Data
www.motorola.com/semiconductors
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
WIRE BOND
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
DIE BOND
SEALED VACUUM REFERENCE
DIE
P1
FLUORO SILICONE
GEL DIE COAT
LEAD
FRAME
ABSOLUTE ELEMENT
VS Pin 2
+5.0 V
GND Pin 3
Vout Pin 4
MPXAZ6115A
to ADC
100 nF
51 K
47 pF
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum) in kPa
TYP
MAX
MIN
2.5
2.0
1.5
1.0
0.5
0
Figure 4. Output versus Absolute Pressure
TRANSFER FUNCTION:
Vout = Vs* (.009*P–.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85
°C
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85
°C temperature range.
The output will saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds
from the environment, while allowing the pressure signal
to be transmitted to the sensor diaphragm. The gel die
coat and durable polymer package provide a media resis-
tant barrier that allows the sensor to operate reliably in
high humidity conditions as well as environments contain-
ing common automotive media. Contact the factory for
more information regarding media compatibility in your
specific application.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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