MPXM2102AS datasheet(295/670 Pages) MOTOROLA

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MPXM2102AS 데이터시트(PDF) 295 Page - Motorola, Inc

295 / 670 page

MPXAZ6115A SERIES

3–149

Motorola Sensor Device Data

www.motorola.com/semiconductors

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self–align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

Figure 5. SOP Footprint (Case 482 and 482A)

inch

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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