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ASX1037 데이터시트(PDF) 13 Page - Advanced Semiconductor Business Inc.

부품명 ASX1037
상세설명  X Band Power Amplifier MMIC
PDF  14 Pages
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제조업체  ASB [Advanced Semiconductor Business Inc.]
홈페이지  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

ASX1037 데이터시트(HTML) 13 Page - Advanced Semiconductor Business Inc.

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ASB Inc.
 sales@asb.co.kr
June 2017
ASX1037
4. Mounting Instructions for Flange Package
4.1 Screw Mounting
4.1.1 The flange of package should be attached using screws. Torque conditions are shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
Recommended
Screw
Recommended
Torque
Maximum Torque
Flange
M2.0
10 N-cm (0.9 lb-in)
15 N-cm (1.3 lb-in)
4.1.2 First, tighten the screws with a torque driver set to 5 N-cm
4.1.3 The surface finish of the heat sinker should be better than 0.8 µm and the surface flatness must
be better than 10 µm.
4.1.4 Silicon based heat sink compounds should not be used for the thermal conductive grease. It
causes the poor grounding of the source flange, contamination, and long term degradation of
thermal resistance between the package and heat sinker.
4.2. Solder Mounting
4.2.1 Recommended solder is lead-free solder (Sn-3.0Ag-0.5Cu) or equivalent.
4.2.2 After soldering, the flux residue should be removed by appropriate cleaning methods.
4.2.3 The recommended soldering conditions are as follows:
Partial heating method: Soldering iron, spot laser/air
Product terminal temperature: 260°C, max. 10 sec/terminal or 400°C, max. 3 sec/terminal



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