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LH0101 데이터시트(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
부품명 LH0101
상세설명  LH0101 Power Operational Amplifier
PDF  12 Pages
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제조업체  NSC [National Semiconductor (TI)]
홈페이지  http://www.national.com
Logo NSC - National Semiconductor (TI)

LH0101 데이터시트(HTML) 7 Page - National Semiconductor (TI)

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Application Hints (Continued)
Thermal Resistance
The thermal resistance between two points of a conductive
system is expressed as
i12 e
T1 b T2
PD
CW
where subscript order indicates the direction of heat flow A
simplified heat transfer circuit for a cased semiconductor
and heat sink system is shown in the figure below
The circuit is valid only if the system is in thermal equilibrium
(constant heat flow) and there are indeed single specific
temperatures TJ TC and TS (no temperature distribution in
junction case or heat sink) Nevertheless this is a reason-
able approximation of actual performance
TLK5558 – 8
FIGURE 2 Semiconductor-Heat Sink Thermal Circuit
The junction-to-case thermal resistance iJC specified in the
data sheet depends upon the material and size of the pack-
age die size and thickness and quality of the die bond to
the case or lead frame The case-to-heat sink thermal re-
sistance iCS depends on the mounting of the device to the
heat sink and upon the area and quality of the contact sur-
face Typical iCS for a TO-3 package is 05 to 07 CW and
03 to 05 CW using silicone grease
The heat sink to ambient thermal resistance iSA depends
on the quality of the heat sink and the ambient conditions
Cooling is normally required to maintain the worst case op-
erating junction temperature TJ of the device below the
specified maximum value TJ(MAX) TJ can be calculated
from known operating conditions Rewriting the above equa-
tion we find
iJA e
TJ b TA
PD
CW
TJ e TA a PDiJA C
Where PD (VS b VOUT)IOUT a
lVab (Vb)lIQ
for a DC Signal
iJA e iJC a iCS a iSA and VS e Supply Voltage
iJC for the LH0101 is about 2 CW
Stability and Compensation
As with most amplifiers care should be taken with lead
dress component placement and supply decoupling in or-
der to ensure stability For example resistors from the out-
put to an input should be placed with the body close to the
input to minimize ‘‘pickup’’ and maximize the frequency of
the feedback pole by minimizing the capacitance from the
input to ground
A feedback pole is created when the feedback around any
amplifier is resistive The parallel resistance and capaci-
tance from the input device (usually the inverting input) to ac
ground set the frequency of the pole In many instances the
frequency of this pole is much greater than the expected 3
dB frequency of the closed loop gain and consequently
there is negligible effect on stability margin However if the
feedback pole is less than approximately six times the ex-
pected 3 dB frequency a lead capacitor should be placed
from the output to the input of the op amp The value of the
added capacitor should be such that the RC time consistant
of this capacitor and the resistance it parallels is greater
than or equal to the original feedback pole time constant
Some inductive loads may cause output stage oscillation A
01 mF ceramic capacitor in series with a 10X resistor from
the output to ground will usually remedy this situation
TLK5558 – 9
FIGURE 3 Driving Inductive Loads
Capacitive loads may be compensated for by traditional
techniques (See ‘‘Operational Amplifiers Theory and Prac-
tice’’ by Roberge published by Wiley)
TLK5558 – 10
FIGURE 4 RC and CC Selected to
Compensate for Capacitive Load
A similar but alternative technique may be used for the
LH0101
TLK5558 – 11
FIGURE 5 Alternate Compensation for Capacitive Load
7



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