Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, contact the National Semiconductor Sales Office/Distributors for

availability and specifications.

LF155/6

LF256/7/LF356B

LF355/6/7

Supply Voltage

Differential Input Voltage

Input Voltage Range (Note 2)

Output Short Circuit Duration

Continuous

Continuous

Continuous

T

JMAX

H-Package

150˚C

115˚C

115˚C

N-Package

100˚C

100˚C

M-Package

100˚C

100˚C

Power Dissipation at T

1, 8)

H-Package (Still Air)

560 mW

400 mW

400 mW

H-Package (400 LF/Min Air Flow)

1200 mW

1000 mW

1000 mW

N-Package

670 mW

670 mW

M-Package

380 mW

380 mW

Thermal Resistance (Typical)

θ

JA

H-Package (Still Air)

160˚C/W

160˚C/W

160˚C/W

H-Package (400 LF/Min Air Flow)

65˚C/W

65˚C/W

65˚C/W

N-Package

130˚C/W

130˚C/W

M-Package

195˚C/W

195˚C/W

(Typical)

θ

JC

H-Package

23˚C/W

23˚C/W

23˚C/W

Storage Temperature Range

−65˚C to +150˚C

−65˚C to +150˚C

−65˚C to +150˚C

Soldering Information (Lead Temp.)

Metal Can Package

Soldering (10 sec.)

300˚C

300˚C

300˚C

Dual-In-Line Package

Soldering (10 sec.)

260˚C

260˚C

260˚C

Small Outline Package

Vapor Phase (60 sec.)

215˚C

215˚C

Infrared (15 sec.)

220˚C

220˚C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of

soldering surface mount devices.

ESD tolerance

(100 pF discharged through 1.5k

Ω)

1000V

1000V

1000V

DC Electrical Characteristics

(Note 3)

Symbol

Parameter

Conditions

LF155/6

LF256/7

LF356B

LF355/6/7

Units

Min

Typ

Max Min

Typ

Max Min

Typ

Max

V

OS

Input Offset Voltage

R

3

5

3

5

3

10

mV

Over Temperature

7

6.5

13

mV

∆V

Average TC of Input

Offset Voltage

R

5

5

5

µV/˚C

∆TC/∆V

OS

Change in Average TC

with V

R

0.5

0.5

0.5

µV/˚C

per mV

I

OS

Input Offset Current

T

3

20

3

20

3

50

pA

T

20

1

2

nA

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